The figure portrays how $85 billion in equipment and materials purchased by semiconductor and microelectronic manufacturers in 2007 supported more than $6.3 trillion dollars in worldwide economic activity made possible through the production of semiconductor computer chips with transistors manufactured at nanoscales since 2001. Equipment for fabricating millions of nanosized transistors in silicon chips which enable modern computers, communications and are found in all modern automobiles, aviation and aerospace equipment. Source: Draft ENIAC Multi-Annual Strategic Plan and Research Agenda 2010 (MASP) proposed by the Aeneas (Association of European Nanoelectronics Activities).
Micro/Nanoelectronics have become integral to life and work – and the trend is ever upward. One "Grand Challenge" identified in the Strategic Plan is the development of extreme ultraviolate (EUV) lithography and complementary 1Xnm patterning as a chip mass manufacturing technology of the next decade.
Technology: Extreme Ultra-Violet (EUV) lithography is anticipated to become the key enabler for More Moore chip mass manufacturing beginning at 22nm feature sizes (half-pitch). Major technology solutions need to be developed: a high throughput EUV machine including e.g. high-power EUV sources and optics for high quality imaging at 13.5nm wavelength; EUV infrastructure and metrology including mask fabrication processes, cleaning, inspection and review tools, sensitive resists, defect engineering and process control. Furthermore, the development of complementary 1Xnm patterning technologies as e.g. e-beam lithography is required for mask making, fast prototyping and low-volume manufacturing.
Commercial Market: EUV lithography addresses a large market with an estimated annual market of $4.5 billion (€3 billion) in 2015. European upfront investments in EUV lithography exceeds $1.5 (€1) billion . The substantial markets for the EUV infrastructure and complementary 1Xnm patterning technologies are additional. It is important to note that Europe’s leading role achieved in the 193nm immersion lithography can only be sustained by a successful introduction of EUV lithography, states the Strategic Plan.
EU Funding Rationale: The high risk in the huge upfront investment and the long-term vision of re-establishing EUV lithography and infrastructure require public funding to realize the multi-billion dollar market potential over the next decade. Furthermore,ENIAC funding will allow Europe to gain in-depth knowledge of leading edge semiconductor manufacturing all over the world and to create and sustained employment of highly qualified individuals in Europe.
ENIAC: The development of EUV lithography and infrastructure, as well as, the complementary 1Xnm patterning technologies are highly involved tasks that require competencies and focused collaboration of large firms, SMEs and institutes from several European countries. ENIAC brings all these entities together in a collaborative $4.5 billion research project that will function through the 2009-2013 time period.
The market for EUV technology, lithography and nanofabrication equipment for the semiconductor, photonic, sensor and MEMS industries is the subject of upcoming report "NANOFABRICATION EQUIPMENT FOR INFORMATION TECHNOLOGY AND ELECTRONICS, A GLOBAL INDUSTRY AND MARKET ANALYSIS"" from Innovative Research and Products Inc.
Micro/Nanoelectronics have become integral to life and work – and the trend is ever upward. One "Grand Challenge" identified in the Strategic Plan is the development of extreme ultraviolate (EUV) lithography and complementary 1Xnm patterning as a chip mass manufacturing technology of the next decade.
Technology: Extreme Ultra-Violet (EUV) lithography is anticipated to become the key enabler for More Moore chip mass manufacturing beginning at 22nm feature sizes (half-pitch). Major technology solutions need to be developed: a high throughput EUV machine including e.g. high-power EUV sources and optics for high quality imaging at 13.5nm wavelength; EUV infrastructure and metrology including mask fabrication processes, cleaning, inspection and review tools, sensitive resists, defect engineering and process control. Furthermore, the development of complementary 1Xnm patterning technologies as e.g. e-beam lithography is required for mask making, fast prototyping and low-volume manufacturing.
Commercial Market: EUV lithography addresses a large market with an estimated annual market of $4.5 billion (€3 billion) in 2015. European upfront investments in EUV lithography exceeds $1.5 (€1) billion . The substantial markets for the EUV infrastructure and complementary 1Xnm patterning technologies are additional. It is important to note that Europe’s leading role achieved in the 193nm immersion lithography can only be sustained by a successful introduction of EUV lithography, states the Strategic Plan.
EU Funding Rationale: The high risk in the huge upfront investment and the long-term vision of re-establishing EUV lithography and infrastructure require public funding to realize the multi-billion dollar market potential over the next decade. Furthermore,ENIAC funding will allow Europe to gain in-depth knowledge of leading edge semiconductor manufacturing all over the world and to create and sustained employment of highly qualified individuals in Europe.
ENIAC: The development of EUV lithography and infrastructure, as well as, the complementary 1Xnm patterning technologies are highly involved tasks that require competencies and focused collaboration of large firms, SMEs and institutes from several European countries. ENIAC brings all these entities together in a collaborative $4.5 billion research project that will function through the 2009-2013 time period.
The market for EUV technology, lithography and nanofabrication equipment for the semiconductor, photonic, sensor and MEMS industries is the subject of upcoming report "NANOFABRICATION EQUIPMENT FOR INFORMATION TECHNOLOGY AND ELECTRONICS, A GLOBAL INDUSTRY AND MARKET ANALYSIS"" from Innovative Research and Products Inc.
